DS VARIATION
Your revolution for a unrivaled flexibility
DS VARIATION picks up dies from the wafer. The dies are placed into carrier e.g. carrier tapes, waffle packs, jedec trays, film frames, glass tools, lead frame or other carriers defined.
„All in ONE“ solution
Flexibility in realizing placement of dies into different packages
Benefits in high volume multi-bin sorting and leads you into various niche applications
100 % quality control in each process step, 6-side inspection possibilities for ultra high resolution inspection
Flip or non flip can be chosen by pushing the software button
Solution fitting exactly to your needs in chip packaging
Your applications
Carrier tape/
Surf tape
Multi Bin
Waffle pack/
Gel Pack®
Wafer
Jedec Tray
