Flip chip bonding & tape inspection
Flip chip bonding is the future oriented assembly of the die onto the IC module tape. The die is flipped by 180° and directly placed onto the contact pads of the module. The parts of wire bonding and encapsulation are not necessary any more.
Die Bonding
Die bonding is the assembly of the chip onto the IC module tape. Mostly epoxy glues are used to fix the chip on the rear side of the tape. The exact pick-up positioning of the chip the wafer is controlled by vision systems (PRS)
Wire Bonding
The Wire Bonder WB 3100 offers the largest bond range in the IC industry and covers the widest package capability range.
Chip module encapsulation
Resin is dispensed to protect the chip and wires against mechanical and environmental stress. Mosty thermal curing (black epoxy) or UV curing materials (transparent materials) are used. The resin is finally cured in an in-line system before the tape is reeled on.
Tape inspection
Tape inspection is the full dimension control of transparent glob tops as well as black globe tops with visual bleed out. The backside of the tape is controlled for surface defects like scratches, fingerprints, etc. Faulty modules are clearly marked by a punch hole.
Chip module encoding and testing
As an output functional test the IC modules are electrically tested. Therefore the modules on the tapes are electrically seperated. Depending on the chip type - memory or microprocessor chip - more or less complex test routines and parameter tests are performed. Faulty modules are clearly marked by a punch hole.
